Electronics Forum | Mon Aug 31 07:56:39 EDT 2009 | d0min0
Hello, since some days we are facing strange problem with SMT component reflow paste on one side of the component is reflowed correctly while the other side is 10%-70% non-reflowed (same component on 3 positions per module, alwyas the same land pad)
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ
What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o
Electronics Forum | Fri May 21 11:59:24 EDT 1999 | John Eramo
Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked very
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Mon Aug 25 20:49:27 EDT 2003 | msimkin
Anyone use glass filled nylon connectors utilising the intrusive reflow techique (pin in paste). We are having probe with them becoming brittle after reflow- apparently due to moisture. We are also seeing bubbling on outside plastic.Peak oven temp 22
Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin
please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t
Electronics Forum | Wed Sep 15 07:34:49 EDT 1999 | Edmund
Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691 non clean 4) board size : 159mm X 159mm
Electronics Forum | Thu Jan 16 17:54:12 EST 2003 | Ren�
Hi burb , reflow temps are same than other profiles just follow your solder paste recomendations , Will help you a lot a solder paste with Silver , or if you want to eliminate completely the granular looking , use nitrogen with your oven ( You will s
Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym
When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no
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