Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown
Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications
Electronics Forum | Tue Jul 14 21:31:19 EDT 1998 | Wen-han Tan
We just have a use cp4 .I have a problem on transfering data between cp3 to cp4 .when I use the data for cp4 I can't have parts in correct location. Is that normal? or it's because that has a different vision system.if so.how can i do with it.the dat
Electronics Forum | Wed Jul 15 08:25:22 EDT 1998 | Dave Kalen
| Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you are
Electronics Forum | Thu Jul 16 12:50:57 EDT 1998 | joe devaney
Dave, We have a rigging company that uses what we call airbags, the same principle like and upside-down air hockey puck. We have moved Fuji machines, verticle carousels (fully loaded with parts), reflow ovens etc. and wouldn't move another machine
Electronics Forum | Tue Jun 23 13:33:23 EDT 1998 | Ben Salisbury
| Ben: Nice answer, but what's a DOE? How do you run one? What other processes do you run DOEs on? Dave F DOE=Design of Experiment Tools used for DOE...Multi-Vari Charts,components search, Pair comparisons, Variables search,Full Factorials, B vs.
Electronics Forum | Thu Jun 18 21:19:17 EDT 1998 | Dave F
| I am currently using some pick & place equipment and would like to measure their cpk using a glass plate and glass "components" with vernier scales. I have seen these kits but am trying to track a supplier down in UK/Europe. | Any help is much appr
Electronics Forum | Sat Jun 27 20:16:20 EDT 1998 | Chris Haynes
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F SRT makes
Electronics Forum | Wed Jun 03 18:19:45 EDT 1998 | Earl Moon
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Wha
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
