Electronics Forum | Wed Jun 07 21:54:11 EDT 2006 | mumtaz
Ha ha! davef finishes you guys off again!
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks
In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Thu Jun 08 09:54:07 EDT 2006 | slthomas
Awwww, man. I was looking for something a little less on the anecdotal side for our local municipality's environmental stewards.
Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas
Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar
Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas
Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some
Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U
Hello, I need your advice..Welcome any input!! Cheers..
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
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