Electronics Forum | Mon Jul 29 09:19:00 EDT 2002 | pjc
Quick Change Tooling is one advantage for DEK when comparing the MPM UP2000. DEK has Form Flex. Good system, but I've heard concerns about long term dependabilty. All support tooling options offered on the UP2000 takes a bit of time to set up. So, If
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
Electronics Forum | Thu Jun 07 14:17:55 EDT 2007 | mfgengr
Thank you ChrisW. I agree completely. The decision to idle the temperature or turn the wave off is primarily a function of machine utilization. Period. The utilization % break even point for idle vs. turning the heat off is calculated by comparing th
Electronics Forum | Thu Jul 30 16:38:40 EDT 2015 | lokit
There are several big competitors out in the field. Since a few years 3D AOI is getting more and more populair. The reliability is much higher compared to comparing grey scales (pixels) with one another. Measuring the height, length and width of a co
Electronics Forum | Mon Jun 27 08:18:47 EDT 2022 | kelvinchoong
Hi All, Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON. Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Paramete
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Sun Oct 15 23:31:39 EDT 2000 | mkwong
I have a question for N2 reflow, I want to know how difference of the O2 PPM in reflow oven then get the result? Now, we use the N2 to purge into BTU oven and measure the O2 PPM is about 1,000. but cannot find the difference to compare to compress ai
