Electronics Forum | Mon Feb 05 21:56:31 EST 2007 | ViVian
what type of solder paste I should use if Rohs and non rohs component mount on same board
Electronics Forum | Thu Aug 20 13:01:40 EDT 2009 | bman
When I've seen white strands in the solder on SMT boards, it's been fibers from stencil wipes that stuck to the stencil, then transfered to the board when it was printed. I'm not sure why this would only happen with fine pitch components though.
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
Electronics Forum | Fri Feb 23 10:10:32 EST 2024 | emanuel
Well, the story is a little more complicated. The product is also an LED lamp made on an aluminum PCB with the LEDs on one side and the drivers on the other. The board itself is not big, about 90x90mm and most of the components are soldering well. Us
Electronics Forum | Tue Jun 02 15:53:32 EDT 1998 | Earl Moon
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Fri May 20 06:34:09 EDT 2022 | jojoled
Hi, I have JUKI KE/FM760L SMT placer, and have strange behaviour in software : I am unable to delete unused components/FEEDERS. 1.I go to placement data, I create 2 records say 0805 and 0603. 2. Then I go to Component Data and I see 2 compoennts are
Electronics Forum | Wed Jun 03 07:13:27 EDT 1998 | Tom Tellinghuisen
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Mon Aug 09 07:37:33 EDT 2004 | C Lampron
Abraham, Lead free components in a leaded process should not be a problem. The problem increases with leaded components in a lead free process. For the most part, the only difference that you will see is in BGA procesing. If a BGA is lead free, the
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
