Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter
I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I
Electronics Forum | Fri Aug 07 02:30:08 EDT 1998 | Bob Willis
| | No sour grapes, | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely on t
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
Electronics Forum | Thu Jul 23 22:50:38 EDT 1998 | Steve Gregory
Hey youse guyz... We're finally getting our first real job at the start-up I'm working at. It's actually a pretty unique little board too. Simple as all get out, but unique. You're not gonna believe what this goes into...guess? (I bet ya' you'll neve
Electronics Forum | Fri Jul 17 14:31:11 EDT 1998 | Steve Gregory
Yeeeeeeeee-Haw! It's FRIDAY!!! There....got that offa' my chest...feel better now..hehehe Is everyone hot enough yet? I think all my volatiles have been driven off, I'm preheated pretty good, so I'm jes' about ready to reflow.....whew! Anyways, I di
Electronics Forum | Thu Jul 09 08:03:48 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Thu Jul 09 08:04:11 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Tue Jun 16 15:39:43 EDT 1998 | Steve Gregory
| | I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. | | Deeply invloved in micro BG
