Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Wed Nov 01 10:03:42 EST 2000 | Wolfgang Busko
Hi Adam, if your product needs the full width of your wave you won�t have any chance to adjust an angle. For smaller PCB�s you might consider having your carriers made in two pieces. One outer piece to match your transportionsystem and one inner cir
Electronics Forum | Wed Nov 01 12:04:46 EST 2000 | JohnW
Adam, Didn't we do this already?, check the archives, I've discussed rotational carriers before. You can use them fo setting up an designing the pallet but you can't use them for mass prouction, for one your waisting valuable pallet space, for anoth
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY
Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your
Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb
I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w
Electronics Forum | Tue Oct 31 19:56:18 EST 2000 | Massimo
I'm reworking BGA with a "SRT Summit 2000". This machine uses a nozzle of the same size of the BGA to conduct nitrogen to the top of the BGA. When I rework big PBGAs (318PBGA, 388PBGA) I've got shorts at the corners (100% of the times!). I think the
Electronics Forum | Fri Oct 27 15:22:08 EDT 2000 | Glenn Robertson
Chris - You are not the first to see this problem. I have seen a similar case on parts from another company. There may be a way to "clean" the parts but I'm not aware of it. Maybe someone else will have an idea. I suggest you ask Motorola h
Electronics Forum | Thu Nov 02 22:05:55 EST 2000 | Dason C
Chris, can we share some more information? I am running Motorola 357 BGA with PN XPC860MHZP50C and the problem for me is a large amount of void (checked by 5DX). I checked the ball surface and found some sketch on every single ball (it may caused by
Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych
Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.
