Electronics Forum | Tue Jan 30 21:20:08 EST 2001 | davef
Juran�s "Quality Control Handbook" [McGraw Hill] is an excellent resource. It is, by and large, accessible by those who are not conversant in the Central Limit Theorem [like who is?], although it will help explain whatever that thing is that I just
Electronics Forum | Tue Jan 10 16:01:20 EST 2017 | davef
A review document for J-STD-001F with Amendment 1 had the following wording, but you should check the actual document to be sure of correctness 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at le
Electronics Forum | Sat Jun 17 08:57:13 EDT 2000 | Ashok Dhawan
Smtnetters One more question on ESD Control program. Does anyone ground there power equipments and how ? e.g., Pneumatic torque tools , electric screwdrivers, hand soldering stations, solder pots etc. I am not sure about pneumatic hand tools , howev
Electronics Forum | Fri Mar 24 03:06:35 EST 2000 | Sal
guys Using a well estrablished water soluble solder paste, but having problems with tack time. Data sheet recommend a couple of hours but we are seeing problems after about 15 minutes with 0402/0603 componenets bouncing off. The printer environment
Electronics Forum | Mon Jan 29 04:27:47 EST 2001 | wbu
Hi Sal, taking the dwell time as parameter to control seems to me unessary. Dwell time is a function of other settings that can be controlled (adjusted) more easily (conveyor speed, wavehight-settings, angle). Although dwell time is essential it�s I
Electronics Forum | Wed Feb 07 21:58:38 EST 2001 | davef
We are reviewing our shelf life policy and have the following items listed as shelf life sensitive: Printed circuit boards, peelable solder mask, solder paste, moisture sensitive parts, multiwire printed circuit boards from Icon or Hitachi, NiCd batt
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef
Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k
Electronics Forum | Tue Apr 17 08:54:09 EDT 2001 | davef
Process capability indices are pretty well documented. Consider: 1 A good general SPC book like: Statistical Quality Control; EL Grant & RS Leavenworth; Mcgraw-Hill; ISBN 0078443547 2 Other good books are: Statistical Process Control For SMT; WS
Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef
This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t
