Electronics Forum | Mon Aug 03 15:04:03 EDT 2009 | davef
We know nothing about your: * Solder alloy * Materials of your board * Materials of your teminal block * Process setup of your wave * Wetting condition of the board or the terminal block ... but we'll take a guess anyhow. Tin-copper based solder all
Electronics Forum | Fri Aug 14 08:01:25 EDT 2009 | davef
So, in order to understand your issue better, please * Tell us more about your process [eg, process flow, machine setting, measured temperatures, etc] * Tell us more about your materials [eg, board, paste, etc] * Describe the extent of the problem [e
Electronics Forum | Mon Sep 21 15:45:35 EDT 2009 | boardhouse
Hi Ryan, Standard shelf life for FR4 Non-RoHs & Rohs material with HASL or Lead Free HASL would be 12 months + in a controlled environment. on all RoHs materials over 6 months, we would suggest your board shop run a solder ability test before ship
Electronics Forum | Tue Mar 09 14:53:16 EST 2010 | davef
Resistivity Of Solvent Extract [ROSE] is a bulk ion contamination [BIC] test method. It should thought of as a process control tool used to assess ionic contaminants. Don't consider it an acceptable tool for establishing 'GO-NOGO' limits. The stan
Electronics Forum | Tue May 25 12:43:00 EDT 2010 | jmedernach
I don't have experience with 1B73. I do have a ton of experience with CE-1155. There are a couple of gotchas with this material. First and foremost is that it HATES silicone residue. If the material is not sticking to parts and they aren't cerami
Electronics Forum | Thu Jan 06 17:33:07 EST 2011 | boardhouse
Hi Johan, Sounds like you have already gone over your product very well to reduce product cost. Switching away from Deep gold Tabs & carbon ink Key pads can save quite a bit. The only other thing to suggest would be material - Moving away from Isol
Electronics Forum | Fri Aug 10 17:19:21 EDT 2012 | tuna73
We implemented MSD controls 10 years ago using a software/hardware system developed by Cogiscan. The system tracks all moisture sensitive material utilizing RFID and Barcode scanning to completely eliminate human error. The system gives real time dat
Electronics Forum | Wed Jun 22 02:30:33 EDT 2011 | boardhouse
if its a RoHs Assembly they should be using an FR4 material designed with higher TD to handle higher Assembly temps. 370HR,IT158, IT180, 4000-29 just to name a few that would be suitable. Standard FR4 material is not designed to handle the higher as
Electronics Forum | Thu Jul 07 14:58:18 EDT 2011 | vickt
Prasad, It is typical when experimenting with new materials to have to adjust the airpressure on the syringe and the stroke of the PDP piston (screw adjust on top of the PDP pump). You can add mutiple cycles in the comp Db to make larger dots with th
Electronics Forum | Tue Nov 15 22:32:07 EST 2011 | doncattoni
Hello Austin, Have you tried to preheat the board or the contact area? Many times with the heat cured materials it will start the cure process and slow the flow of the material. Our Protect-R-Shield silicone product was formulated to be a much thi