Electronics Forum | Tue Sep 21 19:09:54 EDT 1999 | Jason Tomlinson
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Mon Sep 27 18:06:26 EDT 1999 | Scott Cook
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Tue Dec 09 18:28:41 EST 1997 | Herb Hoefle
We want to hire some feeder bins for a Mydata with a view to buying them around 1st week in April ( yes budgets!!!!!!! engineers vs beancounter time again ) Anyone want to help out a bunch of fun loving manufacturing engineers with some info. please
Electronics Forum | Wed Dec 18 01:37:39 EST 2002 | Steve
I dont know what kind of screener you use but my 1st impression is that the board and stencil are separating too fast,the paste doesn't have enough surface tension to stay on the board, you're tearing the paste off the board. If you can, slow down th
Electronics Forum | Sat Jan 04 09:48:22 EST 2003 | Steve
Yes this is 1st generation, a large metal tube positioned horiz. with valves to wet the wiping towel all at once. We have the newer sys. on the other Ekra, motor driven gear rack and selonoid dispenser.I talked w/ their tech. and got "Oh yea,,they al
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Fri Jun 18 13:12:56 EDT 2004 | Cal
we noticed Electroytic caps (Rubber plug), standoffs, and most of the plastic and rubber parts were effected and started to break down. I do not know id the mask material is effected or what residue is left behind ....as we never made it past the 1s
Electronics Forum | Thu Oct 28 14:27:22 EDT 2004 | jdumont
Hi all, I will be looking into ovens shortly for our conversion to lead free. I hear and understand why our Heller 1088 oven wont make the cut for lead free (4 zones isnt enough). Can anyone recommend a good mid range oven? We have been very happy
Electronics Forum | Sat Jan 01 10:41:30 EST 2005 | davef
Is this what you're talking about? http://www.ustreas.gov/press/releases/js703.htm We don't believe the "Technology Investment Incentive Act of 2003" [108th CONGRESS, 1st Session, H. R. 1232: To amend the Internal Revenue Code of 1986 to shorten th
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
Equipment Dealer / Broker / Auctions
104 East Street
Middleton, MA USA
Phone: 978 790-2774
.gif)