New Equipment | Test Equipment
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
New Equipment | Test Equipment
Bestemp Reflow Oven Temperature Tester Bestemp X6 reflow Soldering temperature Tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analysis m
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
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New Equipment | ESD Control Supplies
330801-28-00-165-07-01 330801-28-00-165-07-01 Contact 24/7 hours Manager: Jessica | Email: sales3@amikon.cn Skype: jessica01235483 | Phone: 86-18030235311 https://www.moore-plc-center.com/ http://www.mvme.cn/ Quick details 1)MOQ: 1 Piece 2)A
Multi-die system-in-package with low inductance direct attach of module to system level PCB.
The Microbond line of die attach solder pastes are the best in the industry. Available in RM and NC vehicle systems. Special grades allow for greater metal loading which results in fewer voids under the die.
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
