Electronics Forum: characteristics (Page 6 of 36)

Re: Solid Solder Deposits

Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory

Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach

low thermal emf solder & paste - SAC 405

Electronics Forum | Mon May 12 15:08:53 EDT 2014 | davef

I've never used SAC405. Not for nothing ... Other low temperature solder alloys that you should consider are: * Sn42/Bi58 [138*C]: Alloy for low temperature applications. Attention should be paid to potential embrittlement issues and poor thermal fa

Component dimension classification

Electronics Forum | Tue Feb 29 19:30:09 EST 2000 | Hon Choi

Good Day, Can anyone tell me if component dimensions are standardized from vendor to vendor? For example, would an sot89 component from one vendor have the same dimensions, lead pitch and length as that from another vendor? And is there any place

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F

OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit

applying DOE to SMT process

Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou

Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's

Component dimension classification

Electronics Forum | Tue Feb 29 19:30:09 EST 2000 | Hon Choi

Good Day, Can anyone tell me if component dimensions are standardized from vendor to vendor? For example, would an sot89 component from one vendor have the same dimensions, lead pitch and length as that from another vendor? And is there any place

Adhesive Application by Stencil

Electronics Forum | Thu Mar 22 16:19:40 EST 2001 | rwilliams

In regards to SMT adhesive application by stencil: Can anyone make any recommendations for: SMT Adhesive Material itself? Squeegee Blade Material? Stencil Material? Characteristics/Features of your Stencil? E.g., thickness, aperture ratios, etc... P

Cleaning no-clean residue

Electronics Forum | Tue Apr 17 11:00:55 EDT 2001 | Steve

I have struggled with this myself. Usually where the pressure to clean the residue off is from the people who see the residue but do not understand the characteristics. I have not found a reason to clean residue off. A few people from our design gro

Solid Solder Deposit

Electronics Forum | Wed Oct 17 08:58:05 EDT 2001 | davef

Thank you. I never said that Sipad, Precision Pad, Optipad, and SSD were not available in the US. Are you saying that these products were not developed in Euroland? Please provide links to papers describing the reliability, cost, list of multiple

Lead-Free Formulation Selection

Electronics Forum | Thu Jul 20 12:21:05 EDT 2000 | Dave F

Bob: Some people suggest different lead-free solder formulations for wave, reflow, and hand soldering. * What are your thoughts on this? * What are the factors that contribute to using different lead-free solder formulations for wave, reflow, and


characteristics searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
Blackfox IPC Training & Certification

Benchtop Fluid Dispenser
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software for SMT placement & AOI - Free Download.
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.