Full Site - : damping (Page 6 of 14)

Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at SNEC 2011

Industry News | 2011-01-17 19:42:26.0

Engineered Conductive Materials, LLC, will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall E7, Stand 655 at the upcoming SNEC International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place February 22-24, 2011 at the Shanghai New International Expo Center in Shanghai, China.

Engineered Conductive Materials, LLC

Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at Intersolar Europe 2011

Industry News | 2011-03-31 11:05:40.0

Engineered Conductive Materials, LLC will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall A5, Stand 653 at the upcoming Intersolar Europe, scheduled to take place June 8-10, 2011 at the New Munich Trade Faire Centre in Munich, Germany.

Engineered Conductive Materials, LLC

Engineered Conductive Materials Debuts DB-1538-2 Ribbon Attach Conductive Adhesive

Industry News | 2011-07-06 07:52:00.0

Engineered Conductive Materials introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.

Engineered Conductive Materials, LLC

Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011

Industry News | 2011-08-08 14:36:41.0

Engineered Conductive Materials, LLC will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.

Engineered Conductive Materials, LLC

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Industry News | 2012-04-05 13:59:12.0

Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).

ECM Equipment Sales, Inc.

Engineered Conductive Materials Introduces Spot Curing Conductive Adhesive DB-1590

Industry News | 2012-04-13 19:02:54.0

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars

ECM Equipment Sales, Inc.

ECM to Showcase Snap Cure Low-Cost Conductive Adhesives for Interconnecting Solar Cells at Intersolar NA 2012

Industry News | 2012-06-12 08:47:07.0

Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Engineered Materials Systems, Inc.

VisionMaster Masters 3-D SPI with the Introduction of the M500

Industry News | 2012-09-07 14:49:58.0

VisionMaster, Inc debuts the M500 Manual 3-D SPI system.

VisionMaster, Inc.

Engineered Material Systems Introduces New Low-Temperature Cure Die Attach

Industry News | 2013-01-21 08:57:51.0

Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices

Engineered Conductive Materials, LLC

Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications

Industry News | 2013-02-26 16:18:07.0

Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.

Engineered Conductive Materials, LLC


damping searches for Companies, Equipment, Machines, Suppliers & Information