Technical Library: first article inspection (Page 6 of 26)

Governing Autonomous Vehicles: Emerging Responses For Safety, Liability, Privacy, Cybersecurity, And Industry Risks

Technical Library | 2022-01-12 19:21:29.0

The benefits of autonomous vehicles (AVs) are widely acknowledged, but there are concerns about the extent of these benefits and AV risks and unintended consequences. In this article, we first examine AVs and different categories of the technological risks associated with them. We then explore strategies that can be adopted to address these risks, and explore emerging responses by governments for addressing AV risks.

National University of Singapore

Designing PCBs for Test and Inspection

Technical Library | 2012-12-14 14:17:56.0

This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design.

Teradyne

An Automatic Surface Defect Inspection System for Automobiles Using Machine Vision Methods

Technical Library | 2020-08-27 01:15:10.0

Automobile surface defects like scratches or dents occur during the process of manufacturing and cross-border transportation. This will affect consumers' first impression and the service life of the car itself. In most worldwide automobile industries, the inspection process is mainly performed by human vision, which is unstable and insufficient. The combination of artificial intelligence and the automobile industry shows promise nowadays. However, it is a challenge to inspect such defects in a computer system because of imbalanced illumination, specular highlight reflection, various reflection modes and limited defect features. This paper presents the design and implementation of a novel automatic inspection system (AIS) for automobile surface defects which are the located in or close to style lines, edges and handles. The system consists of image acquisition and image processing devices, operating in a closed environment and noncontact way with four LED light sources. Specifically, we use five plane-array Charge Coupled Device (CCD) cameras to collect images of the five sides of the automobile synchronously. Then the AIS extracts candidate defect regions from the vehicle body image by a multi-scale Hessian matrix fusion method. Finally, candidate defect regions are classified into pseudo-defects, dents and scratches by feature extraction (shape, size, statistics and divergence features) and a support vector machine algorithm. Experimental results demonstrate that automatic inspection system can effectively reduce false detection of pseudo-defects produced by image noise and achieve accuracies of 95.6% in dent defects and 97.1% in scratch defects, which is suitable for customs inspection of imported vehicles.

Nanjing University

Fix The Process Not Just The Product

Technical Library | 2015-04-03 20:02:31.0

Understanding your process and how to minimize defects has always been important. Nowadays, its importance is increasing with the complexity of products and the customers demand for higher quality. Quality Management Solutions (QMS) that integrate real-time test and inspection results with engineering and production data, can allow the optimization of the entire manufacturing process. We will describe the cost and time benefits of a QMS system when integrated with engineering data and manufacturing processes. We will use real examples that can be derived from integrating this data. This paper also discusses the aspects of Quality Management Software that enables electronic manufacturers to efficiently deliver products while achieving higher quality, reduce manufacturing costs and cutting repair time. Key words: Quality Management Software, ICT, Repair workstations, First Pass Yield, Pareto analysis, Flying Probe, QMS.

Digitaltest Inc.

Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures

Technical Library | 2022-02-09 17:52:47.0

This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.

Georgia Institute of Technology

Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

Technical Library | 2012-11-29 14:23:58.0

1000 units per day) production environment presents challenging technical, logistic and cost obstacles that are usually more complex than those encountered at the inspection (automated optical inspection) and the manufacturing process test step (in-circuit test).

SiFO Technologies

Using X-Ray Systems To Detect Counterfeit And Reworked Electronic Components

Technical Library | 2021-03-18 20:03:27.0

Much has been said and written about the accuracy of visual attribute inspections of potentially counterfeit components. The techniques and procedures being used to inspect counterfeit and reworked electronic components in the open marketplace can be quite effective in most cases.

World Micro

Printing of Solder Paste - A Quality Assurance Methodology

Technical Library | 2015-10-01 16:12:51.0

Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix between large modules and small chip components on large and densely populated printed circuit boards. Having a process for quality assurance of the solder paste print is fast becoming a necessity.This article describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. This information should be used as feedback in order to improve the solder paste printing process.

Ericsson AB

AOI-AXI Duo Improves Product Yield

Technical Library | 2009-08-26 19:32:32.0

Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards. While some companies opt for one technology over the other, each form of inspection contributes its own unique benefit to the manufacturing process.

Nordson YESTECH

Stereo Vision Based Automated Solder Ball Height Detection

Technical Library | 2015-04-16 16:11:43.0

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...) In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement.

Intel Corporation


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