Full Site - : gold-plated (Page 6 of 60)

LCR-Reader: the Consumers' Choice LCR-meter

Industry News | 2014-05-16 12:25:04.0

Siborg Systems Inc. has released a new budget model of popular handheld LCR-meter

Siborg Systems Inc

Updated Model of Smart Tweezers: the ST-5S

Industry News | 2014-05-16 12:37:30.0

Siborg Systems Inc. releases Smart Tweezers ST-5S, an updated model of the popular ST-5 model.

Siborg Systems Inc

JX Nippon Mining & Metals

Industry Directory | Manufacturer

JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.

Metal Base PCB

Metal Base PCB

New Equipment | Fabrication Services

Based on the special application of PCB, Aluminum base material and Copper base material are used to replace the traditional FR-4 material. Eastech has very mature production and manufacturing experience for PCB based on metal materials. We always br

Eastech Group Circuit Technology (ShenZhen) CO., LTD

Gold Replating Kit

Gold Replating Kit

Videos

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

soldertools.net

Ludee Circuits

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other

Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.

Printed Circuit Board

Printed Circuit Board

New Equipment |  

1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, P

Shangahi XF-UTPCB [Factory] CO.,LTD

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Gold Contact Replating Kit

Gold Contact Replating Kit

New Equipment | Rework & Repair Equipment

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

soldertools.net


gold-plated searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Easily dispense fine pitch components with ±25µm positioning accuracy.
PCB Handling Machine with CE

Benchtop Fluid Dispenser
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.