Electronics Forum: ipc 610 (Page 6 of 42)

Flux evaluation

Electronics Forum | Wed Dec 29 12:27:39 EST 2010 | davef

Flux evaluation * J-STD-004, Requirements for Soldering Fluxes * IPC-A-610, Acceptability of Electronic Assemblies

Conformal Coating Guidelines

Electronics Forum | Thu Aug 05 20:50:31 EDT 2021 | davef

IPC-A-610G Acceptability of Electronic Assemblies, 10.8 Conformal Coating

Palladium leaded devices IPC610 class3 acceptable

Electronics Forum | Tue Oct 22 20:37:09 EDT 2002 | davef

Pd takes longer to desolve than the materials yer used to using. Search the fine SMTnet Archives for background on modifying your reflow recipe.

What standards should electronic manufacturing meet?

Electronics Forum | Fri Mar 19 09:48:02 EST 2004 | Patticake

I have a similar question. What are the major differences between J-std-001 and IPC 610 class 3 ?

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

Quality Inspection post Wave

Electronics Forum | Mon Jul 18 09:43:31 EDT 2005 | norrin_radd

Aside from a visual first article to IPC 610, what inspection criteria do people put in place post wave solder (pre clean)? Thank you

LLP Device

Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax

Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.

Solder paste volume require.

Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane

can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol

LIGHTING ON THE SHOP FLOOR......

Electronics Forum | Mon Sep 25 11:43:56 EDT 2006 | mrduckmann2000

HELP, I AM SEEKING THE PROPER CANDLE POWER FOR A SHOP FLOOR THAT IS WORKING TO IPC-610 CLASS II AND III STANDARDS. ANYONE KNOW WHAT THE MIN AND MAX SHOULD BE??? THANKS FOR THE HELP!

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D


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