71 logic results

Placement Optimisation in a Lean Manufacturing Environment

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Embedded Thermoelectric Cooling Article

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

Power Supply Control from PCB to Chip Core

Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current

Conductive Adhesives: The Way Forward

Conductive Adhesives: The Way Forward Conductive Adhesives: The Way Forward Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead

Assembling the Next Electronic Equipment Generations

A High Performance and Cost Effective Molded Array Package Substrate

Component Shortages Causing Electronics Manufacturers to “Use All Means Necessary” to Ship Products

Multilayer PCB Stackup Planning