922 molded interconnect device results

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts by: Dave Becker; All Flex Flexible Circuits Flexible Circuits are proven, reliable interconnect

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

wider use of 3D devices, tougher requirements are no

Color Based Printed Circuit Board Solder Segmentation

Color Based Printed Circuit Board Solder Segmentation Color Based Printed Circuit Board Solder Segmentation As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays

Package Converter Compliments Chip Obsolescence

electronics, telecommunications, automotive, medical devic

Evaluating Soldering Irons for Lead Free Assembly

SMTnet Express - May 26, 2022

Embedded Thermoelectric Cooling Article

Embedded Thermoelectric Cooling Article Embedded Thermoelectric Cooling Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly

Technical Considerations For Controlling ESD In Electronics Manufacturing

Technical Considerations For Controlling ESD In Electronics Manufacturing Technical Considerations For Controlling ESD In Electronics Manufacturing As device geometries get smaller and processing speeds grow faster, their ESD sensitivity

BGA Package Component Reliability After Long-Term Storage