Industry News | 2015-09-23 16:47:32.0
Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.
Industry News | 2019-06-09 19:50:17.0
Viscom Inc. today announced that it has been selected by Epoch International for its AOI and SPI needs at its new facility in Fremont, California. Epoch has been using Viscom’s AOI and SPI systems at its China facility, and recently invested in the Viscom 3D AOI model S3088 ultra blue and 3D SPI model S3088 for its new Silicon Valley location.
Industry News | 2021-10-07 15:42:42.0
Seica will be exhibiting at the SMTA International show in Minneapolis, MN on November 1-4, 2021 in booth 3432. On display will be our flagship Pilot V8, undoubtedly the most extensive flying probing test platform on the market. This system will be demonstrating full In-circuit testing as well as on-board programming, using Seica's innovative Device Clip programmer and integrated Flypod option, which ensures quick, reliable connection to any connector or programmable device on the DUT. To enhance test coverage where traditional ICT test methods may not be used, the Flypod can also provide access to the DUT for 3rd party Boundary Scan test solutions, to perform cluster tests and run BSD files. The system on display will also showcase its power up test capability, which enables many additional test techniques to be applied, such as LED testing. In addition, Seica's QuickTest software environment allows the user to easily generate and incorporate functional test routines within full ICT test programs.
Industry News | 2009-12-07 18:07:44.0
CyberOptics Limited has announced plans to showcase its SE500X advanced 100 percent 3-D solder paste inspection system, the newly developed ‘larger board’ version in the SE500 series at Productronica 2009. Hot on the heels of the successful debut of the original SE500 in Germany at the 2009 SMT/Hybrid/Packaging show, CyberOptics will feature the fastest inspection system on the market in Hall A2, Stand 417 at Productronica. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2024-04-03 07:36:16.0
Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.
Industry News | 2010-01-19 05:29:53.0
PROCAM - Automatic Gerber to Centroid (CAD) Extraction Software
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
