Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca
Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal
Electronics Forum | Mon Jan 22 03:51:16 EST 2007 | Bing
We are using HASL board for Press Fit, without problem in the past until recently. Now we are seeing the solder in the PTH melt and block partially the PTH hole during the reflow. It gives problem when Press Fit. Anyone has advice on this?
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Thu Oct 04 20:50:45 EDT 2007 | itaig1
We recently purchased an IBL VPP-M600 vapour phase reflow oven. We currently only have partial documentation and need to know the requirements for the water cooling. ie flow rate, cooling power etc. We also need the spare parts listing and service ma
Electronics Forum | Fri Feb 09 11:48:09 EST 2007 | realchunks
0.25mm tilt? That's pretty small depending on you BGA size. Is it failing? Or just your Q.E. being anal? What size BGA we talking about? What ball count? Just one board? Maybe cheaper to just repair. Now assuming there is NO part under the BGA
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee
I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate
