Electronics Forum: ramping (Page 6 of 61)

Lead Free Delta T (reflow 7 zones)

Electronics Forum | Wed Mar 15 21:34:07 EST 2006 | Chunks In Cebu

I can see why he left. Not knowing your board or paste, but I would tend to say your profile is on the cool side. Unless your boards are very small and your conveyor speed is slow, I'd say this is no good. It looks like you're using the old "ramp,

SAC305 Solder Balling

Electronics Forum | Thu Aug 17 09:01:26 EDT 2006 | russ

Well my friend, flux chemistries have changed. I do not want to drive you over edge but I use a straight ramp for lead as well!!!! Let the product dictate process!! I only soak when the delta T is not manageable with straight ramp. Please do not

best way to have pcbs leave stand alone reflow oven

Electronics Forum | Wed Feb 10 15:55:19 EST 2021 | ttheis

We just use a ramp to a cart and the line operator loads them into trays as they come out. There are buffer conveyors or magazine loaders you could use. Or do a little industrial automation with a plc and proximity sensors; combine a ramp and a belt

Reducing Warp after reflow

Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1

I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that

Re: Thermal Stress in Reflow

Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper

| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe

Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s

Skewed components

Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima

Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p

SMT Reflow temp

Electronics Forum | Wed Mar 11 17:32:46 EDT 2015 | jlawson

Small paste deposits have less flux thus less flux activity to enhance the wetting. So preheat needs to be as short as possible, ramp to spike if possible. Try not to ramp hold and spike - pending thermal delta on product can be made to ramp to spike

Halogen-free Solder Re-flow Quality Issues

Electronics Forum | Fri Oct 02 10:34:20 EDT 2015 | dyoungquist

After looking at your profile, some general thoughts.... Your profile looks like what is commonly called a ramp-spike profile and not a ramp-soak-spike profile. Going off of Sarason's comment, you may not have a good soak period before the spike in

Re: Tombstoning

Electronics Forum | Fri Dec 17 08:45:26 EST 1999 | Wolfgang Busko

Hi Henry, amoung all things that cause this funny effect the most effective measures in my experience were good PCB design (pads and equal thermal conditions for both sides of the components), placement accuracy and profiling, profiling, profiling. L


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