| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Zhang Abstract 28-1 PoP Rework - A Case Study Robert Wettermann Abstract 2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Abstract 27
| http://etasmt.com/cc?ID=te_news_industry,5361&url=_print
. 9, Production repeatability and consistency of the solder: As the electronic assembly process is a high-volume manufacturing process, requiring the repeatability and consistency to maintain a high level, if certain alloy composition is not in bulk conditions
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. This solder alloy is relatively cheap, has fine grains, and exhibits good solderability. However, due to the high percentage of Sn, it is also prone to tin whiskers and tin pest
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. This solder alloy is relatively cheap, has fine grains, and exhibits good solderability. However, due to the high percentage of Sn, it is also prone to tin whiskers and tin pest
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
Blackfox Training Institute, LLC | https://www.blackfox.com/should-you-use-lead-or-lead-free-solder/
. What Is Lead Solder? Also known as SNPB Solder, Lead-based solder is a metal alloy composed of 60 percent tin and 40 percent lead
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
| http://etasmt.com/te_news_industry/2013-07-03/5361.chtml
. 9, Production repeatability and consistency of the solder: As the electronic assembly process is a high-volume manufacturing process, requiring the repeatability and consistency to maintain a high level, if certain alloy composition is not in bulk conditions
