Electronics Forum: shiny joint (Page 6 of 11)

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph

Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they

Germanium doping of SN100

Electronics Forum | Fri Dec 21 13:51:16 EST 2007 | howard stevens

Gentlemen, This is an interesting topic. If one refers to the Nihon Superior patent, they make the following claims. "Germanium makes the crystal finer when the alloy solidifies. Germanium appears on a grain boundary, preventing the crystal from b

Pb free BGA voids

Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd

Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints

smt rework

Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.

I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp

Sn100C - anyone use this at Reflow?

Electronics Forum | Wed Mar 18 16:50:20 EDT 2009 | khowell

There are many users of SN100C in reflow. SN100C was originally introduced as a wave solder alloy which offered cost savings over SAC, no solder pot erosion, and high fluidity. Since it is eutectic, no plastic range, the joints have a smooth, shiny

Re: bare board problem

Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook

| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads

Solder Ball After Reflow Process

Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry

LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting

Re: bare board problem

Electronics Forum | Fri Jun 18 11:37:10 EDT 1999 | Earl Moon

| | | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pa

AIM SN100C Solder paste

Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower

Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently


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