Industry News | 2013-08-30 09:54:58.0
Kyzen announces that it received a Best Paper award for its recent presentation during NEPCON South China, which was held from August 27-29, 2013.
Industry News | 2015-03-16 06:51:04.0
Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.
Industry News | 2023-12-11 12:19:27.0
Transition Automation, Inc. recently received a large order for Advanced Holder and Blade Assemblies compatible with DEK printers from Rotec BV in Belgium. This order – the third in recent months to Rotec – comes as Transition Automation seeks to realign Permalex distribution with a concentration on high-tier partners.
Industry News | 2009-12-17 18:08:57.0
MYDATA's Jet Printer MY500 has won the 2009 Global Technology Award, sponsored by Global SMT & Packaging. The prize was presented at a ceremony at Productronica, a showcase of innovative electronics production techniques, in Munich, Germany, on November 10, 2009.
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2014-08-28 11:13:11.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.
Industry News | 2015-04-07 17:14:44.0
KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.
Industry News | 2013-11-15 17:04:20.0
The popularity of jet printing technology to apply solder paste to printed circuit boards is growing fast as more and more electronics manufacturers understand the key advantages over traditional methods of solder paste application, such as screen printing or dispensing. Today hundreds of electronic producers worldwide are using jet printing for a diverse range of applications – situations that demand speed, design freedom and high-quality solder joints.
Industry News | 2018-03-11 11:38:15.0
Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
