Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto
Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Wed Oct 19 18:47:28 EDT 2022 | winston_one
I can understand the situation, when there is now possibilitie to change board design, or something like this at the moment, and now you have to work with what you have now... Customers and management can bring a stupid situations... But I'm agree w
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Fri Apr 29 04:36:49 EDT 2011 | city4497s
Hi Anyone encounter this type of reflow issue before?
Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov
Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w
Electronics Forum | Mon Mar 22 10:24:03 EST 2004 | davef
Wrinkled like orange peel?
Electronics Forum | Thu May 05 01:21:42 EDT 2011 | city4497s
Hi Davef The problem shows up on * random location including component pads * all PCB and different PCB supplier * different solder paste lot * both printing and dispensing process * all production shift * we have only 1 production line It black,
Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel
The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching
Electronics Forum | Fri Apr 29 08:28:17 EDT 2011 | markhoch
Is it possibly being caused by surface contaminants on your PCB? Or possibly flux residue? Is this a one time occurance, or are you seeing it regularly? Is it happening in other areas on your PCB or in just this location? Can you please provide more
