Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Fri Jul 06 18:19:41 EDT 2001 | davef
The senior staff have the pictures!!! Oh, that�s just GREAT!!! What the blank are these gerbils doing with �em? Nothin�!!! They�re probably sitting in a folder on whatzisname�s desk, until he has "a change to study them more". [Like he�s going t
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Mon Oct 02 10:22:13 EDT 2006 | SteveH
We are having issues with cleaning underneath leadless chip carriers due to their extreme low lying nature and I wondered if anyone else had any experience of this. Our process for years has been vapour degreasing with Triklone N, which works, but w
Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers
Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Wed Aug 04 00:17:41 EDT 2004 | Shean Dalton
Additionally, increases in temperature can increase the water's rate of reaction with the flux. Sometimes, only a 5 degree change can make the cleaning difference. If the flux inconsistently presents itself, then the likely cause is something in
Electronics Forum | Fri Aug 06 15:32:03 EDT 2004 | Shean Dalton
Thanks for providing the pictures. We evaluated what we could see and have the following idea's. 1) Because of different thermal charatoristics between the topline and your product, your Motorola BGA solder joints may have experienced a higher refl
Electronics Forum | Tue Aug 10 15:28:54 EDT 2004 | Shean Dalton
Because the HASL process most deal with bare metals, HASL flux residues are generally more active than solder paste residues. Typically a Rosin Active (RA) flux is used in the HASL process. These flux residues should be removed from the bare board
