Electronics Forum | Wed Mar 15 12:39:24 EDT 2017 | cyber_wolf
Customer precedes standard, but customer must be educated and informed on what is achievable with their design and what is accepted as industry standard practice. My guess is that the negative effect of those voids is negligible. {Voids at the sold
Electronics Forum | Tue Mar 14 14:13:14 EDT 2017 | cyber_wolf
I don't have an answer but I am curious. What data/testing shows that this voiding is detrimental? How did the auto industry arrive at
Electronics Forum | Wed Mar 15 06:58:43 EDT 2017 | cyber_wolf
Rob, That's what I suspected but I would be interested to see studies that show that the voids are in fact detrimental to thermal and electrical performance. If the automotive industry is requesting
Electronics Forum | Wed Mar 15 11:43:45 EDT 2017 | rob
Hi PZ, What, sort of like this one? http://creativeelectron.com/papers/EconomicsofLEDVoiding.pdf It even has the handy calculation for the reduction in thermal performance with voiding.
Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto
From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their
Electronics Forum | Thu Mar 16 03:45:51 EDT 2017 | rob
It's the same thermal issue whether it's a die or package. It's different if it is just a signal trace, but if it's a heatsink pad (LED, FET, Motor driver, PSU IC etc). I think the voiding issue boils down to what the part is actually doing. The or
Electronics Forum | Tue Mar 14 14:15:03 EDT 2017 | dontfeedphils
I've always been happy with ~25% or less combined voiding on QFN ground pads (depending on the pad dimensions).
Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob
It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading
Electronics Forum | Wed Mar 15 10:12:22 EDT 2017 | pzappella
Hello, A speaker at the conference is where I heard that the auto industry wants
Electronics Forum | Wed Mar 15 11:51:35 EDT 2017 | cyber_wolf
Rob, I believe that is for die attach voiding not solder interface.
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