Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef
Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
