Electronics Forum | Fri Nov 14 17:15:54 EST 2014 | tombstonesmt
Are you experiencing the solder balls on the opposite side of connector insertion or same side? If it's the same side as connector insertion how many strokes are you using at? We've experienced a few issues with pin in paste, everything points back
Electronics Forum | Mon Nov 17 14:42:02 EST 2014 | tombstonesmt
Sounds like your snap off profile needs adjustment. More than likely there is paste under the stencil being transferred over to the board. Try adding a cleaning cycle after every board to determine if this is the issue. If the solder balls go away af
Electronics Forum | Thu May 05 07:58:35 EDT 2016 | cyber_wolf
Not sure what you mean. 0201's and 0402's are both on 8mm feeders. Juki's will do simultaneous picks an all 8mm feeders no matter the component size. Your feeders need to be maintenanced and calibrated to reliably pick 0402's and 0201's. I hav
Electronics Forum | Fri Feb 23 09:12:13 EST 2024 | carl_p
How have you created the oven profile? Have you taken into account the heat soak from the components/board/carrier etc. Is the paste being mixed correctly before use, is the paste in its use by date & at ambient temp etc? I thought almost all the
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
Electronics Forum | Tue Jun 02 17:36:43 EDT 1998 | Chris Fontaine
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
Electronics Forum | Fri Jul 17 11:57:25 EDT 1998 | Justin Medernach
| I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress di
Electronics Forum | Wed Aug 07 08:49:35 EDT 2002 | davef
What do you want to be certified? So, do you have a specification control drawing for each component that defines your expected performance capabilities for use by your buyer in acquiring these parts? If there is a reason to fabricate parts to your
Electronics Forum | Wed Oct 08 00:28:31 EDT 2008 | khushi
Dear, Flexkhushi > Do you mean 2 mm thick board or .2 mm board. If > you are talking .2mm then you are refering to a > flex circuit correct? What equipment will you be > using to place the 01005 component? I am not sure > if you can even place a
Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
