Electronics Forum: differs (Page 539 of 579)

adhesive for thermocouple

Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef

Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes

Procedure to evaluate a reflow oven

Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef

Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop

Electromigration Testing

Electronics Forum | Thu Jul 01 10:24:31 EDT 2004 | davef

There is no specification for �Ion Chromatography for Ionic Cleanliness�. The performance of your product in your customer use environment determines the level that you select. The good part for you is that have at least one pole that you can put i

25 mil QFP soldering issue

Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek

This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet

Programming feeder Setup

Electronics Forum | Fri Aug 20 05:50:40 EDT 2004 | finepitch

Yes, you need to use "dedicated feeders" and only make changes when you run out of a part. It may even be better if you could convince the stock room and keep stock for those parts right on your line. The environment has to be proper for that though,

SMT tact time

Electronics Forum | Thu Aug 26 13:20:56 EDT 2004 | pjc

Machine design plays a major factor in actual placement rate vs. the published tact time max speed. For example, random access horizontal turret head machines can vary greatly depending on nr. of different components and size ranges, while the dual g

Lead Protrusion

Electronics Forum | Wed Sep 22 22:44:34 EDT 2004 | davef

We agree with Paul. If you prepare the components differently, so that they snap into place, you do not need to trim after wave. Most rotary trimmers put a HUGE amount of stress on solder connections, potentially cracking the connections. Some of

SMT PLACEMENT EQUIPMENT

Electronics Forum | Mon Oct 04 14:05:06 EDT 2004 | pjc

Please be careful about responses you get. Opinions run rampant and it is not wise to make a decision on equipment based on opinions of others. For example, you may get five negative replies on a piece of equipment from five incompetent idiots. Certa

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Dec 15 16:38:42 EST 2004 | patrickbruneel

Here's my 10 cents Studies done in the 1980's concluded that pure tin was prone to whisker generation. A tin content lower then 70% became exempt from this phenomenon. I have never seen or done any studies on the impact lead had in reducing the pote

MYDATA Myspeed software is total junk

Electronics Forum | Thu Jan 13 09:00:42 EST 2005 | fasst1

Grant, Again, just my .02 worth. I would have to agree with Greg as well. Two Flex machines from the same vendor will give you much better line balancing, and I think better overall capability than adding a different type of 'animal' chip shooter


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