Electronics Forum | Tue Jun 20 10:29:14 EDT 2006 | Chunks
I was afraid so. Hand soldering wires in general is not difficult, but with your constraint of the space restriction it does make fairly hard to do. I am assuming you have a 2 sided board and stranded copper wire. So once solder starts to flow, th
Electronics Forum | Fri Sep 15 15:51:53 EDT 2006 | MFG CAVEMAN
We have a new product that uses an SMT edge connector. The process we are using is as follows: -Screen print side 1 (no paste on connector pads) -Place Rs & Cs -Reflow -Screen print side 2 (paste on connector pads) -Slide connector into side 2 wet
Electronics Forum | Tue Oct 03 22:48:21 EDT 2006 | C.K. the Flip
It sounds as if this Sn100c HASL process is still in its infancy requiring further process development and characterization..weather its a better more active flux or a different profile... Given your situation of the Sn100c coating actually "repellin
Electronics Forum | Mon Nov 27 16:52:18 EST 2006 | greg york
Hi Bill Mostly in the UK, but originally saw the problem when I helped on one install in Malta on a chinese mc set at 5 degrees and had nightmare bridging. changed the angle to 6.5 ish and results were instantly better actually better than what they
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas
What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Mon Mar 03 23:24:06 EST 2008 | Mag10
I have a project to evaluate solderability of various metals or plated finish. I'd like to tap in to get some advise. The project is to evaluate solderability of various metals or plated finishes for RF shield application with reflow. Due to the hig
Electronics Forum | Mon Apr 14 16:21:58 EDT 2008 | ck_the_flip
Bottom-side SMT parts CAN and DO go liquidus during the 2nd reflow cycle. It could be that there was enough variability between the 2 different lot code PCBs to cause the parts to fall off. Remember wetting force determines surface tension (the abi
