Electronics Forum | Fri Aug 24 01:25:58 EDT 2018 | cupet
Hi everybody, please advise in case of soldering problems after the reflow soldering. The problem occurs randomly at different locations on different PCB's (not the complete surface of the board). These places are very difficult for rework. Could you
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Sat Feb 16 07:21:17 EST 2019 | SMTA-Joe
I am experiencing a "tarnishing" issue on PWB traces that may be causing problems with component reflow. The PWB traces are made to the following spec: SOLDER MASK OVER BARE COPPPER WITH SILVER IMMERSION PLATING PER IPC4553, PLATING TO BE 8-12 MIC
Electronics Forum | Sun Feb 17 17:55:21 EST 2019 | davef
Each time that you cook imm surfaces, you give-up coating thickness. Spec IAg can take maybe 4 thermal cycles ... [that's what I remember but those could be PbSn, not SAC cycles]. Anyhow, the more that you decrease coating thickness, the more that Cu
Electronics Forum | Tue Jul 21 05:08:16 EDT 2020 | arty vesna
Hi there. I am currently kinda in the same spot as the author of the thread. My choice is between Rehm VXC and Heller 1809. I am a little concerned about Heller advertising their 25cm/10 in zones. I am used to large ovens designed for high throughput
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker
Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i
Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc
I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to
Electronics Forum | Tue May 24 21:48:23 EDT 2005 | steve
You can continue repair and rework with tin/lead solder until 7/06. However!!! Any product still on the shelves overseas after 7/06 will be returned to the USA. Thought? Maybe start repairing with SAC305 now? Also SAC is Tin, Silver and Copper. No Ni
Electronics Forum | Thu Jan 05 11:23:49 EST 2006 | samir
Grant I'm gonna have to go ahead and sort of disagree with you there. The studies that I've been reading from various BGA Manufacturers have identified insufficient homogenizing / coalescing of the Sn/Pb Paste with the SnAgCu balls. Ball not touchi
