Electronics Forum | Fri Jul 23 04:27:59 EDT 2004 | greg york
Many trials conducted so far from single sided to Mixed technology dual wave with our LFB227/S 0.3Ag silver Lead free. Results are excellent, some say better than 63/37. One continueing problem though is the age old area of undercured resist and runn
Electronics Forum | Fri Jul 23 05:03:31 EDT 2004 | loz
I'd be interested to hear what the PWB vendors have to say about your comments. This is something I have questioned before, but I fail to see how this problem can be proved. Because of all the technicalites of the wave soldering process, it is someti
Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd
I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4
Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef
We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Thu Jul 22 23:49:53 EDT 2004 | Eric Dahilig
Any of you guys can recommend micro dot paste dispensing equipment capable of fine pitch (around 0.5mm) and 0.3mm pad size? I have a current project that needs the below requirement and we are trying on with the said process apart from the current s
Electronics Forum | Fri Jul 23 06:18:12 EDT 2004 | Chris L.
Good Morning Everyone, I have a question that probably doesnt have a definitive answer. I have been asked to try to establish a norm for RMA rates. My first thought is the goal is always 0% but knowing that that is not readily achievable, I am in se
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Wed Jul 28 10:29:20 EDT 2004 | johnthor
They are 6 volt, 10 watt bipin halogen and not hard to get. You do need to retain the metal housing. Take the screw out of the small pc board where the pins of the bulb project and pry it off. Scrape or grind out the hard material that holds the b
Electronics Forum | Tue Jul 27 11:16:40 EDT 2004 | carterhoward
Hello , I agree with the solder ball theory, we used to have an issue with high humidity and it produced the results you�re describing. Our solution to this since adding dehumidifiers was too costly was to increase the quantity of intake ducts for t
