Electronics Forum | Fri Sep 24 08:19:35 EDT 2004 | Rob
Hi FengAng, Sorry about the misunderstanding - last time I was out there all of the front end SMT equipment was very good, but the final assembly of the phones into cases was being undertaken by hand, whereas in Europe we were seeing a lot of automa
Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo
Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d
Electronics Forum | Mon Sep 27 15:25:55 EDT 2004 | HOSS
JD, Have you considered manual dipping? For that low of a volume, the purchase cost and maintenance wouldn't seem economical but I'm not in your shoes. With hand dipping, you don't have the thickness control you may need but it can be done. If yo
Electronics Forum | Wed Oct 13 12:24:08 EDT 2004 | davef
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Electronics Forum | Tue Sep 28 22:39:01 EDT 2004 | pdeuel
I dont speek Chineese. When I need support I prefer dealing with people who speak my language. I like my job. The more jobs lost to over seas companies make job market here harder to find work. Thousands of parts go into reflow ovens. So we are not t
Electronics Forum | Wed Sep 29 02:16:37 EDT 2004 | FengAng
Hi all, Our department need to setup a reliability lab. And some equipments are need to purchase. At the first stage, thermal cycling test are going to be imported. If anyone of you have this kind of experience, please don't hesitate to SHARE me h
Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe
FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p
Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith
Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp
Electronics Forum | Thu Sep 30 03:33:58 EDT 2004 | pioneertechnology
Hi All We have two boards that we produce which are chip on glue. For this we use KME BD12's which use air to dispense the glue dot on to the board. This is not ideal as the glue dot size differs as we go down the tube causing us quality problems.
Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
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