Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Mon Jun 21 18:15:05 EDT 1999 | George Forrest
We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. Does anyone
Electronics Forum | Mon Jun 21 21:05:47 EDT 1999 | Dave F
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Thu Apr 29 19:52:32 EDT 1999 | WinTech mfg
I would like to know if there is any good training for Hand Soldering, Component Identification, Wave Soldering, and so on. I have seen two diffenent tapes and they were short and poorly done, I would like to buy some if I knew it had some good Trai
Electronics Forum | Sat Mar 06 10:39:34 EST 1999 | Sam Sangani
I am looking for a barcode machine/printer which will print barcode directly on printed circuit boards with non transferable white ink. This has to be done before PCB assembly. Any help will be appreciated. Please reply directly to my E-mail. S
Electronics Forum | Fri Mar 12 13:41:06 EST 1999 | stefano bolleri
| I am looking for a barcode machine/printer which will print barcode directly on printed circuit boards with non transferable white ink. This has to be done before PCB assembly. | | Any help will be appreciated. | Please reply directly to my E-mai
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Thu Feb 25 10:11:08 EST 1999 | Joe Cameron
Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts a
Electronics Forum | Wed Feb 17 17:55:33 EST 1999 | Zboss
My name is Joe Zuchowski I am the production manager for a shot run contract manufacturer in the midwest. I would like more information on Automatic Optical Inspection Systems from actual users and someone that has done the trial and error. The onl
