Electronics Forum | Mon Jan 15 13:12:18 EST 2007 | realchunks
So others can solder the same board and part but you can't. Dipping the legs in flux doesn't help. Then it's either your pre-heat or wave. Measure your pre-heat and compare to others or flux mfger. Do you have chip wave or something like an Omega
Electronics Forum | Tue Jan 16 07:59:36 EST 2007 | tk380514
we worked out that the wave soldering cassettes Duratstone material takes alomst 35 degree away from the surface of the pcb, and the speed is already too slow it should be over 1.0 - 1.8 meters a minute but its now already 82 cm a minute, in order to
Electronics Forum | Mon Jan 15 15:18:13 EST 2007 | jaimebc
We have an oMniflow 7 as well, and looking at the calibration procedure, it indicates that turning the pots ( total of 5 pots. 4 on the lower board and one on the upper board )fully counter-clockwise is the FIRST step of a series of tests. Then you w
Electronics Forum | Mon Jan 15 16:14:15 EST 2007 | leemeyer
This is a used oven, new to us. No product has been setup on it yet. We were establishing som baseline profiles and noticed that the actual profile read didn't even come close to our optimal profile. Further investigation proved that the belt was to
Electronics Forum | Mon Jan 15 21:54:19 EST 2007 | raychamp007
Dear Friend, Our SMT Production & component ware house RH currently control limit set to 40%RH - 60%RH, but not always achievable, the RH reading measurement are between 38%RH -65%RH. J-STD-001D recommend 30%RH - 70%RH. However it is only a recommen
Electronics Forum | Tue Jan 23 12:22:12 EST 2007 | Grant
Hi, I ran a clean room once, and the humidifiers were built into the exit air ducts, and controlled by a humidity control unit that kept things at 60%. We were loading VHS tapes, and needed to keep humidity at that level or static discharges caused
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Thu Jan 18 12:37:21 EST 2007 | slthomas
At this point I'm comfortable with my suppliers, although we will definitely look at the machines running and verify they'll build our products to our satisfaction. All three machines meet or exceed our requirements for component range, speed, accu
Electronics Forum | Wed Jan 17 22:35:21 EST 2007 | JNet
Is the oven air or nitrogen? If it is air I would suggest more exhuast to pull the flux vapors out if the oven before they can condense in the cooling. If it is a nitrogn machine that makes it a little more complicated. If the filter system is clogge
