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Pick & place

Electronics Forum | Tue Mar 27 16:29:52 EDT 2007 | dyoungquist

We are a high mix - low/medium volume company running an older MyData upgraded TP9 machine. It does a good job placing 20 mil pitch and 0402 components. We have not tried to place 15 mil pitch. Breakdowns/repairs have been relatively low consideri

Pick & place

Electronics Forum | Tue Mar 27 19:58:13 EDT 2007 | colormaker

I have only used the Quad 4C, We bought it used and ran good right out of the box without the need for repairs. It uses quadaline and does not work very well on IC's. We place 30K 1206 parts a week with a 4 % dump to bin. I have to tolerance set to 3

Pick & place

Electronics Forum | Wed Mar 28 20:35:52 EDT 2007 | darby

Quadalign is very similar to the Samsung. I would think that 4% dump on 1206 or even IC is way over the top. If you are certain that your component data is correct; I suspect that your z-axis centring height may be out of whack and that you are eith

Intrusive reflow

Electronics Forum | Sun Mar 25 17:02:41 EDT 2007 | johnwnz

Folks, I may be havign a thick day, it is Monday afterall and it has been very sunny over the weekend. We have recently started buildign a fairly high volume of products that is using intrusive reflow on two PTH DIN connectors and havign soem good s

top side remelt?

Electronics Forum | Mon Mar 26 07:38:26 EDT 2007 | davef

The temperature that will melt solder holding top side SMT components during wave soldering depends on the alloy of that solder. So, for example, you'd expect: * Near eutectic SnPb solder to melt around 215*C. * LF to melt around 240*C. It's common

top side remelt?

Electronics Forum | Mon Mar 26 20:04:04 EDT 2007 | Amy

Yes, I have tested some boards, and found that most QFPs which near the via will have the higher temperature. One of my customer requirement is to have the temp less than 200 deg C for top side. We were using the hi temp wire to solder the QFP's for

top side remelt?

Electronics Forum | Tue Mar 27 07:34:57 EDT 2007 | ck_the_flip

Amy, One way you can drastically lower the peak temperature of your QFP and prevent it from re-melting is to lower the solder pot temperature. If you're running 63/37 in your pot, the typical range for these is 460�F to around 500�F. You will need

parameter triggers & Industry Standard on Calibration Intervals

Electronics Forum | Mon Mar 26 21:30:24 EDT 2007 | davef

Welcome back Comments are: * There's a lot of bla bla bla about using statistical measures to determine calibration intervals. It's all over the web. * MIL-STD-45662A Calibration Systems Requirements - WITHDRAWN [Notice 2, Dated: 27 February 1995]

parameter triggers & Industry Standard on Calibration Intervals

Electronics Forum | Tue Mar 27 15:25:43 EDT 2007 | ianchan

Hi Dave, Thanks for your input; what I understood the gentleman was describing was a ISO/MIL/ANSI standard that actually plots out a chart (e.g. timeline/frequency of use versus environmental variable parameter, where the variable may be dust, oil,

Production Testing - HASS

Electronics Forum | Tue Mar 27 04:23:27 EDT 2007 | donjohnson

You know the products operating limits,and these have been pushed out during development using Highly Accelerated Life Testing (HALT) 2> Proof of Screen has been conducted to ensure that wear out failures are not induced by the screen If the above


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