Electronics Forum | Mon Aug 31 14:03:41 EDT 1998 | Bill Childs
I have a question on tenting of vias on PWB's. I have designed a 6 | >layer, military, mixed components (all on top side), LPI soldermask | >board which will be run over the wave. I was planning on tenting vias | >but did not specifically specify tha
Electronics Forum | Mon Aug 17 21:22:55 EDT 1998 | Brian S. Bentzen
I don't know a lot about the WEB, my company's interface, or the differences between various browsers and versions. I do know that since your change over my response has gotten so slow that I no longer can spare the time to read the forum. Only occ
Electronics Forum | Mon Aug 17 19:43:43 EDT 1998 | Bill Schreiber
Smart Sonic has a new Model 2003 Stencil Cleaner that is designed to clean SMD adhesives, solder paste and post solder flux residue from wave solder pallets, oven air amplifiers, etc. all in the same system at the same time with the same chemistry. C
Electronics Forum | Sat Aug 15 13:26:05 EDT 1998 | Bob Willis
| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? The European standard often quoted is 1.5 mg/cm which ia achievable on a board assembly please remember one
Electronics Forum | Mon Aug 10 11:58:33 EDT 1998 | Wayne Bracy
| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer
Electronics Forum | Tue Aug 04 10:44:41 EDT 1998 | Chrys
| | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | Also, has any one
Electronics Forum | Thu Jul 23 17:54:29 EDT 1998 | Cunli Jia @ SMTnet
Ben, Thought your message should have been posted to the PCBCE Mart but it does belong to here for now. We have been trying to build up the Blue Book to help answer exactly your question but so far progress there has been slow. If you get any info
Electronics Forum | Fri Jul 24 00:59:47 EDT 1998 | Jon Medernach
| Yes, I realize that COB isn't really SMT (it is on the surface), but where can I get some free (IPC has some stuff for sale), fast info. about IC pad spacing for COB? | Thanks The Create Group at Panasonic Factory Automation is the leader in automa
Electronics Forum | Wed Aug 05 10:57:09 EDT 1998 | Jim Price
| | Yes, I realize that COB isn't really SMT (it is on the surface), but where can I get some free (IPC has some stuff for sale), fast info. about IC pad spacing for COB? | | Thanks | The Create Group at Panasonic Factory Automation is the leader in
Electronics Forum | Wed Jul 22 10:26:46 EDT 1998 | Bob Yost
My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board.
