Electronics Forum | Wed Sep 03 12:44:34 EDT 2008 | Bob Douglas
When considering MSD issues two factors really need to be focused on; first, environmental control of the individual subject component/s during storage and second, monitoring of the packages out of the controlled environment. It's important that eac
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
Electronics Forum | Thu Aug 21 05:08:09 EDT 2008 | ihamon
Hi, We had a electric failure on a printed wired board after a few hours of functionning. We determined that the failure was caused by a open circuit in the PCB internal layer near to a via. We performed a microsection but unfortunately, it seemes t
Electronics Forum | Thu Aug 21 14:38:32 EDT 2008 | Paul M.
I have had a similar problem as this. But, not on that particular type of component. Have your machine place the component, take the PCB over to a microscope and look at the part how it sit's on and in the paste on the pads. You might see that one
Electronics Forum | Fri Aug 22 13:10:51 EDT 2008 | bschreiber
The folowing articles are available at: http://www.smartsonic.com/article.html "Why Not Ultrasonic Cleaning?" by William Kenyon "Damage-Free Ultrasonically-Assisted Cleaning of Printed Circuit Assemblies" - by B.P. Richards et al "Does Ultrason
Electronics Forum | Mon Aug 25 08:26:33 EDT 2008 | scottp
We've gone through this a couple times. Once it was because the device was warping in reflow. We confirmed with shadow moire that the corners were lifting up. The supplier fixed some things in their molding process to reduce the warpage. Another
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef
Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma
Electronics Forum | Wed Aug 27 17:12:34 EDT 2008 | mikesewell
Silicone contamination could appear as fisheyes or dark spots under UV light. 1A33 can be heat cured but is a single component oxygen cure coating - it needs a source of oxygen to cure. An unvented oven may slow or limit the cure. Check out the TDS
Electronics Forum | Mon Aug 25 14:58:04 EDT 2008 | arrowventures
I really need a replacement Manual for a Electrovert Omni 5 reflow oven vintage 1999. I would be happy to pay someone for it. I would even be fine with a copied version of the manual, and I would pay for that. If someone has a manual and is willing t
