Electronics Forum | Mon Nov 01 15:35:25 EST 2004 | Ken
Agreed. You will find different part manufacturers have different coplanarity specs. In fact I have on supplier that calls out 7 mil max coplanarity. Then factor in board bow and twist and it becomes a real joy.
Electronics Forum | Wed Nov 03 07:12:01 EST 2004 | davef
We've had discussions similar to this previously. Search the fine SMTnet Archives, while you're waiting for others to respond.
Electronics Forum | Sat Nov 13 12:22:55 EST 2004 | GS
Hello, very interesting informations you can find on: - IPC-CH-65A Guidelines for Cleaning of Printed Board and Assemblies. - IPC-AC-62A Aqueous Post Solder Cleaning hand Book GS
Electronics Forum | Sat Nov 13 00:50:05 EST 2004 | KEN
Place the part on a board with double sided sticky tape. I bet the part is sliding around AFTER mounting. The tape would proove this. Also, are you sure your not dragging on the scrap counter? Maybe the height of the part is just touching the un
Electronics Forum | Mon Dec 06 00:44:45 EST 2004 | donb
You probably have already done this... but you need to enter the maintenance program with the maintenance key, select "Set Prefs" scroll down to "Upline Machine" and enter "Fuji".
Electronics Forum | Mon Dec 06 21:41:13 EST 2004 | pdeuel
I have the same problem but an MPM downstream of the Fuji. Im looking for schematics for this Fuji. Before we had another machine hooked to this Fuji and the output switch needed to be set to latch. Otherwise only a pulse was seen and it was not long
Electronics Forum | Tue Dec 07 00:53:48 EST 2004 | donb
I think I have schematics for a Fuji loader here. Let me know if you want me to scan & email or fax some pages.
Electronics Forum | Tue Nov 30 11:08:22 EST 2004 | jdumont
Hey all, we will be starting to coat our PCB's soon. I am looking for info on what type of UV light is needed to inspect the boards. We will be using Humiseal 1B73 Acrylic coating. TIA, JD
Electronics Forum | Wed Mar 16 02:06:13 EST 2005 | amstech
What is the joint stand-off gap anticipated after the board level assembly and reflow? If it is designed per CSP standards, there should be no issue in water cleaning. If the gap is 90 � 100 micron, better to go with a no clean paste. His needs good
Electronics Forum | Tue Dec 14 09:32:59 EST 2004 | patrickbruneel
Hi Paul, One thing I can tell you for sure "lead free" is not going to solve your problem, because spectrum analysis have shown that dendrites at there final stage always consists of pure tin. The higher the tin content the higher the risk for dead
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