Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Thu Aug 20 00:16:56 EDT 2009 | padawanlinuxero
Hello I am having a problem with the flux in the wave solder, I am using a sonoflux 9000 this machine uses a air knife to spray the flux, it creates a mist that when hits the air knife pulls the mist up to the pallet where the board is, but for som
Electronics Forum | Thu Aug 20 13:15:58 EDT 2009 | ratsalad
Yes, you should be able to. The feeder interface for the GSMs (not Advantis or Genesis) has been the same as far back as I can remember... And we used to have a D-block machine. We use some of the same feeders from that old D-block GSM on the GSM
Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi
Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22
Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your
Electronics Forum | Wed Aug 26 18:58:07 EDT 2009 | rossi
I am not sure that it is the pillow problem. With the pillow problem you tend to see residual solder on the pad and voids where this solder pulled from on the ball. What we are seeing is a very thin flat layer of solder on the pad and a flat surface
Electronics Forum | Mon Aug 24 06:12:31 EDT 2009 | ghepo
joanne please pay attention, each heavy no-clean flux residues not completely heated due to hand soldering becomes a moisture absorbing conductive pathway, causing electrical leakage. So I suggest you to clean well the board after hand soldering or
Electronics Forum | Mon Aug 24 07:32:34 EDT 2009 | hurr
Hi Joane, this flux is primarily designed for wave soldering. I think that manual soldering it´s possible. Certainly it´s very hard to dispensing correct amount of the flux. Succinic acid is one from all ingredients of this flux. If you have this
