Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac
My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Fri Jun 11 04:38:05 EDT 1999 | Gyver
| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d
Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt
| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d
Electronics Forum | Mon Jun 14 14:30:42 EDT 1999 | Deon Nungaray
| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Wed Jan 14 14:36:29 EST 1998 | Mike Cox
Your questions would require volumes of information to answer completely. This is a readers digest version to help you get started volumes Don't rely on inspection as a process indicator of your quality and defect levels. Unfortunately Inspectio
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
