Electronics Forum | Fri Dec 08 09:48:11 EST 2006 | SMTRework
Hi Guys / Gals, just curious as to how some of you approch BGA pad damage? (ie broken or lifted pads) Also, what kind of success rate have you found with your method?
Electronics Forum | Wed Jul 30 11:36:31 EDT 2014 | emeto
About the pads shape - you can do rectangular or oblong. For stencil design oblong is better for small pads(0.2mm) because it will give better release, so having this thought in mind you should probably design oblong shape and then print make paste a
Electronics Forum | Wed Jul 30 11:41:06 EDT 2014 | emeto
example
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Fri Oct 26 05:03:17 EDT 2018 | farouk225
Hi everybody, I have a question about the minimum distance to leave beteween a non non-plated mounting hole with copper pads and the edge of the PCB. Is there any formula or rule to apply ? For example for a hole of diamater equals to 5.6mm which
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
Electronics Forum | Thu Jul 31 10:14:27 EDT 2014 | matusov
I know that some board houses have better > capability than others. Some can do down to 4mils > mask in between the leads I think. I know that it > also depends on the type of the mask they are > using - for some types you can't go down to the >
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
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