Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Electronics Forum | Fri Jul 13 12:32:14 EDT 2007 | rgduval
We've experienced this issue with SN100. A couple of things we've tried, all with varying levels of success: 1. Longer pre-heats. We use SN100 in a solder pot, and pre-heat the boards on our wave machine. This did have a positive effect, but I ne
Electronics Forum | Fri Nov 16 08:33:46 EST 2007 | rgduval
For RoHS assemblies, we're spec'ing at least FR-406 for the higher Tg. We're currently requesting our customers to use ENIG finish, as we've had better luck with assembly in our process; but we're currently experimenting wtih lead-free HASL. As far
Electronics Forum | Sat Aug 23 08:43:32 EDT 2008 | davef
Ugh, there are more reasons that immersion silver [IAg] to go yellowish than pigs at the county fair. That aside, sulphur is one of the reasons, as you say. The sulphur can be from a variety of sources, such as: * Pollution in the air * Ill advised p
Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135
The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Mon Nov 02 07:32:44 EST 2009 | umar
Hi..., We have build the PCBA base on IPC 610 and J-std-001 class 3 product, All the ESD pre caution been implement at my production side, ESD flooring, wear the ESD smock, wear the ESD shoe, use the finger coat and those not use the finger coat the
Electronics Forum | Fri Apr 23 13:00:35 EDT 2010 | dwonch
Hi all, The board shop finally got back to me with some results. They did find residue present on some of the pads. They have sent a board out for evaluation to learn what it is. Hopefully from that we can determine the root cause. The good news i
Electronics Forum | Fri Jun 18 17:36:10 EDT 2010 | sid
Good afternoon all, I have been trying to find a solution to a defect I just noticed. After stencil printing and smt part placement on the secondary side of my boards, I run them through a wave soldering system. All my components got soldered perfe
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