Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper
The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not
Electronics Forum | Tue Aug 15 08:49:13 EDT 2017 | kalsi311
Yes Evitmov, you can say I am more comfortable with mirae machines then advantis. I just want to know if somebody worked on MR series mirae machines and Fusion UIS machines so he can give me an advice witch one is better. Definitely I will not buy mo
Electronics Forum | Thu Aug 10 11:55:18 EDT 2017 | emeto
I am going to implement a part number system in our production. Still debating what is the better approach. Does anyone use intelligent part number system(where numbers integrates part package, value, tolerance, carrier, voltage requirements....)? I
Electronics Forum | Thu Aug 10 13:27:29 EDT 2017 | dilogic
I prefer simple sequential P/N system. We use digits 0-9 and english aplhabet (total of 34 characters). Letters I and O are ommited to avoid mix-up with digits 1 and 0. P/N is 6 characters long - long enough to cover ~1.5 billion parts but short eno
Electronics Forum | Fri Aug 11 22:14:59 EDT 2017 | dawson
Hi Adonys, What's ICP 1-3? Do you mean IPC? 1. Excess Plating- no excess, but filled with something which generated in the process of copper plating. 2. Dark Vias - it's oxidized. and the solder mask printing is not aligned. The board is failed. M
Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice
There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with
Electronics Forum | Mon Aug 14 12:46:41 EDT 2017 | deanm
Any of the comments so far could be valid. To add my opinion, it looks like the pad size is too large. A smaller volume of solder will pull less than a larger volume. If you can't change the pad sizes, then the next thing to try is to get another ste
Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf
I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak
We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin
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