Electronics Forum: 0201 problem (Page 7 of 10)

Fiducials on feeders

Electronics Forum | Wed May 22 15:56:43 EDT 2002 | stefwitt

The play of the tape is quite significant as I mentioned in an earlier thread. Tape width can vary between 8.1 +/- 0.2mm. Demos on 0201's are most likely done with 8.1 +/- 0.05mm tape. I guess you are referring to the cover tape pull, which can dispo

Warming up solder paste at start of days production

Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN

Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili

0402 tombstones

Electronics Forum | Fri Apr 17 10:44:29 EDT 2009 | rmitchell

Hi, follow up, Thanks to everyone that responded. We finished the build, the sun burst thru the clouds and the birds sang. Well that was a slight exageration. Sorry for lack of detail on the original post, I was frazzled. Since the 0201's were p

Recommanded profile for 0402 & 0201.

Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail

What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac

Warming up solder paste at start of days production

Electronics Forum | Wed Jul 28 07:59:50 EDT 2004 | cyber_wolf

Ken, With all due respect: Surface mount is surface mount. Whether you are placing 0201's, or PLCC84's the basic concept is the same. So I would surely hope that for the most part my process is transferable. I guess I was too broad when I said "we n

epoxy/polyethylene

Electronics Forum | Thu Dec 18 13:07:50 EST 2014 | kevinb

I have worked with Epoxy Technology in the past with silver epoxy. Just to fill you in on what I have been doing with this project in the past. I was using a silver epoxy for my 0201s. I then over molded with an epoxy with a dam and fill. Then th

solder balls

Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker

Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under

Re: Pad Design

Electronics Forum | Fri May 01 22:32:38 EDT 1998 | Jon Medernach

A pad design shaped like Home Plate will eliminate the problem, You can get info from Create Group at Panasonic FA They have the patent on this style pad and the most experience working with the 0402 and now have qualified the 0201 Caps from Murata

Accuracy Requirements for New Technology

Electronics Forum | Thu Apr 07 09:56:01 EDT 2005 | bystrom123

I am having a common problem, justifying capitol expenses. We are currently using 0402's and BGA's and CGA's with 1MM centers. Our current equipment is horrible, we have a hand operated screen printer machine (No vision system) and we are placing all

New SMT line - Need equipment selection help

Electronics Forum | Fri May 27 14:37:05 EDT 2005 | Frank

Look into the Juki KE-2060E machine. I have been extremely pleased with this machine. It will hold 80-8mm feeders, place 0201 (0603-metric) up to 74mm square ICs and BGA, 150mm long connectors. Up to 25mm tall components. It can handle up to 30 t


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