Industry News: 6 mil (Page 7 of 9)

Cornell Dubilier Rugged Capacitor for Robust Commercial & Military-grade Power Supplies

Industry News | 2023-04-17 00:37:22.0

The Cornell Dubilier Low-Profile MLPS Flatpack Capacitor Provides Extraordinary Life and Reliability in Rugged Applications

New Yorker Electronics

New Yorker Electronics Releases Vishay Load Switches with Programmable Current Limits & OVP Enhanced Reliability

Industry News | 2023-04-17 00:34:01.0

Four New eFuse Single-channel Load Switches Integrate Control and Protection Features to Reduce External Components

New Yorker Electronics

ADLINK Launches MXC-6400 Series of High-Performance Fanless Embedded Computers

Industry News | 2016-09-07 12:47:48.0

ADLINK Technology announces its new MXC-6400 Series of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i7/ i5/ i3 processors (codename Skylake) and the QM170 chipset. Along with leading performance, high storage density from 4x 2.5" SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6400 Series fully meets the needs of Intelligent Transportation Systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

ADLINK Technology, Inc.

ESSEMTEC to Highlight Key Products and Technologies at APEX 2009

Industry News | 2009-03-27 09:58:30.0

Essemtec announces that it will feature its innovative products in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas. These machines will be offered at Special Show Pricing, so be sure to stop by the booth.

ESSEMTEC AG

DuPont Circuit & Packaging Materials Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards

Industry News | 2010-04-12 16:09:04.0

RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.

DuPont

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

Gen3 Systems Announces Product Lineup for Southern Manufacturing

Industry News | 2016-02-02 12:18:54.0

Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.

Gen3 Systems

Gen3 Systems Invites Customers to Learn About Solderability Testing at S.E.E. Stockholm

Industry News | 2016-04-12 08:24:44.0

Gen3 Systems Limited is pleased to announce that it will exhibit at the S.E.E. show in Stockholm, scheduled to take place April 19-21 at the Kista Expo Center. Gen3 will showcase its solderability and contamination testers with its Swedish distributor, ESD Centre, in Booth CO2:30.

Gen3 Systems

NEO Tech Ranks on the Inc. 5000, Inc. Magazine’s 35th Annual List of America’s Fastest-Growing Private Companies

Industry News | 2016-08-23 16:20:23.0

NEO Tech announces that it placed on Inc. magazine’s 35th annual Inc. 5000, the most prestigious ranking of the nation’s fastest-growing private companies. The list represents a unique look at the most successful companies within the American economy’s most dynamic segment — its independent small businesses.

NEO Technology Solutions (NEO Tech)


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