Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Tue Feb 22 08:40:12 EST 2005 | JB
A couple of features on your stencil printer that should help with a couple of potential printing processes: A temperature control unit and the automatic understencil cleaning with the chemical of your choice. That alone, will reduce the chances of
Electronics Forum | Wed Dec 08 20:15:25 EST 2010 | davef
What is the solids content of your solder? 50%??? Then, theoretically, if the aperture is 1:1, you'll have 2 thou of solder on your pads.
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Wed Apr 18 17:29:14 EDT 2018 | emeto
Can you send me a screenshot to see how it looks or a spreadsheet of the data? Do you have to modify anything on your own? Can you do it for some selected components/apertures or it has to be on the whole PCB? Any further info will be appreciated.
Electronics Forum | Mon Dec 29 14:47:36 EST 1997 | justin medernach
| how to determine the optimum solder paste height ? Ray, This is a gross misconception within the industry. There is no optimum solder paste height, per say. The effectiveness of a solder joint should be quantified in volume. Use your process as
Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
