Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Wed Jul 11 22:44:50 EDT 2012 | joeion
Why cannot reply????
Electronics Forum | Fri Jul 06 10:35:32 EDT 2012 | ashworth14
All i used to do was blow them with an airline to remove the excess moisture then bake them for 15/20 min at 100' in an oven and that seems to work fine, i did get the info from a 4 stage cleaning guide for the actual cleaning solution we used but it
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Fri Dec 03 04:11:47 EST 2010 | grahamcooper22
A baking oven over 100 C will be at zero humidity. Do you really need to store pcbs/devices at 200 C...this will surely harm some products ? IPC 33B01 allows storage of MSDs in a dry cabinet at less then 5%.....these can operate at room temp or 40 /
Electronics Forum | Tue Dec 07 07:26:50 EST 2010 | grahamcooper22
In an oven over 100 C any moisture will escape through vents. There will not be huge volumes of moisture in the oven when you are baking components so it should easily escape through vents / holes in the system leaving you with a humidity of near zer
Electronics Forum | Fri Jul 06 05:28:59 EDT 2012 | jsolloway
..... that's very strange. If there were any risk of de-lamination then it would of occurred during the reflow process, surely. Unless the through hole department are using heat guns or wave sodler? I doubt if the sales or planning team are happy if
Electronics Forum | Fri Dec 03 05:32:03 EST 2010 | libandara
Dear Graham, Thanks for the information. is there any way to control the humidity inside the oven..? At over 100 C. how the evaporated vapour from the component remove out from the oven..?
Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
