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DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

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Matsushita Electric (Panasonic) Completes Switch to Lead-Free Solder Used for Printed Circuit Boards

Industry News | 2003-05-28 08:20:13.0

Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.

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DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

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Terminal Blocks Handle the Hazards

Industry News | 2003-04-14 08:50:52.0

Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.

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Northrop Grumman Enters Military Printed Circuit Board Market

Industry News | 2003-04-15 08:39:15.0

Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)

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Good Chemistry: UIC, RBP Form Sales, Tech Support Pact

Industry News | 2003-02-10 08:20:11.0

Leading Suppliers of Chemistries for Circuit Board Processing Have Entered a Selling and Services Deal

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Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

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For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

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Merix Corporation to Present at the Raymond James & Associates 24th Annual Institutional Investors Conference

Industry News | 2003-02-24 09:47:35.0

Mark R. Hollinger, Chairman and CEO, will present at the Raymond James 24th Annual Institutional Investors Conference at 2:40 p.m. ET on Tuesday, March 4th.

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Park Electrochemical Corp. Declares Cash Dividend

Industry News | 2003-03-24 09:38:49.0

Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.

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